Description
Description
The Mini Solderless Breadboard is a compact prototyping platform designed for small electronic circuits and quick testing applications. It features 170 tie points with a standard 2.54 mm pitch, making it suitable for DIP IC breakout, sensor connections, and breadboard-based development projects. The snap-fit design allows multiple boards to connect together for expanded prototyping space, while the self-adhesive backing and M2 mounting holes provide secure installation options. Ideal for embedded systems, educational electronics, and rapid hardware prototyping.
Features
- 170 tie-point solderless prototyping area
- Standard 2.54 mm pitch spacing
- Compact design for small circuits
- Snap-fit edges for board expansion
- Peel-and-stick adhesive backing
- Dual M2 mounting holes
- Compatible with DIP package ICs
- Supports reusable circuit prototyping
- White ABS plastic housing
- Nickel-plated spring contacts
- Suitable for jumper wire connections
- Lightweight portable construction
- No soldering required
- Reliable contact retention design
- Ideal for educational electronics projects
Specifications
- Tie Points: 170
- Terminal Strip Points: 17 10 rows
- Pitch Spacing: 2.54 mm
- Board Type: Solderless Mini Breadboard
- Contact Material: Nickel-Plated Spring Metal
- Housing Material: ABS Plastic
- Color: White
- Mounting Method: Adhesive Backing and M2 Holes
- Compatible Wire Size: 2029 AWG
- Board Dimensions: 47 35 10 mm
- Mounting Hole Diameter: M2 Compatible
- Reusable: Yes
- Operating Temperature: -20C to 80C
- Application Type: Rapid Circuit Prototyping
- IC Compatibility: DIP Packages
Links
- Mini Solderless Breadboard 3D Model
Tutorials
- How To Use a Breadboard – Breadboard Basics
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