Description
Description
The Full-Size Solderless Breadboard is designed for rapid prototyping, circuit testing, and electronics development without soldering. It features 830 tie points with dual split power rails and a standard 2.54 mm pitch layout compatible with DIP ICs, sensors, and development boards. The interlocking design allows multiple boards to be connected for larger projects, while the self-adhesive backing provides secure mounting during operation. Suitable for educational labs, embedded systems development, and electronic prototyping applications.
Features
- 830 total tie points for circuit prototyping
- Standard 2.54 mm pin spacing
- Dual split power rails design
- Compatible with DIP IC packages
- 10 terminal columns layout
- 63 connection rows configuration
- Self-adhesive backing for secure mounting
- Interlocking side tabs for board expansion
- Supports 2029 AWG jumper wires
- Solderless reusable construction
- Nickel-plated contact clips
- ABS plastic housing material
- Suitable for Arduino and Raspberry Pi projects
- Ideal for testing and educational applications
- Compact full-size breadboard format
Specifications
- Total Tie Points: 830
- Terminal Strips: 630 tie points
- Power Rails: 200 tie points
- Terminal Columns: 10 columns
- Terminal Rows: 63 rows
- Pin Pitch: 2.54 mm
- Center Gap: 7.62 mm
- Supported Wire Size: 2029 AWG
- Power Rail Type: Split dual rails
- Mounting Type: Self-adhesive backing
- Board Type: Solderless breadboard
- Material: ABS plastic housing
- Contact Material: Nickel-plated spring clips
- Board Dimensions: 165 55 9 mm
- Compatibility: DIP ICs, Arduino, Raspberry Pi, sensors and modules
Links
- 830 Tie Points Breadboard 3D Model
Tutorials
- How To Use a Breadboard – Breadboard Basics
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