Description
Description
The Aluminum Heatsink (40 40 20 mm) is designed to improve thermal dissipation in electronic circuits, power devices, and embedded systems. Manufactured from high thermal conductivity aluminum, it efficiently transfers and dissipates heat generated by components during operation. Its compact finned structure increases cooling surface area for enhanced airflow and thermal performance. Suitable for use with thermoelectric Peltier modules, voltage regulators, LEDs, MOSFETs, CPUs, and other heat-generating electronic applications.
Features
- Aluminum construction for efficient heat dissipation
- Compact 40 40 20 mm form factor
- Finned design for increased cooling surface area
- Lightweight and corrosion-resistant material
- Suitable for thermoelectric Peltier modules
- Improves thermal stability of electronic circuits
- Compatible with LEDs, MOSFETs, and voltage regulators
- Passive cooling without additional power consumption
- Durable structure for continuous operation
- Optimized for natural and forced air cooling
- Easy integration into embedded projects
- Suitable for DIY and industrial applications
- CNC-machined aluminum body
- Supports heat reduction in compact enclosures
Specification
- Material: Aluminum
- Dimensions: 40 40 20 mm
- Cooling Type: Passive Air Cooling
- Surface Finish: Anodized Aluminum
- Structure Type: Finned Heatsink
- Thermal Application: Electronic Heat Dissipation
- Compatible Devices: Peltier Modules, LEDs, MOSFETs, CPUs
- Corrosion Resistance: Yes
- Mounting Method: Thermal Adhesive or Mechanical Fastening
- Weight: Approximately 35 g
- Color: Silver
- Heat Transfer Method: Conduction and Convection
- Operating Environment: Indoor Electronic Applications
- Reusable: Yes
Tutorials
- How to Mount an Aluminum Heat Sink on a Peltier Module – Step-by-Step Installation Guide
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